Product overview
- Part Number
- FW-13-03-G-D-085-118
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 4 Gbps
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 26 Position
- Number of Rows :
- 2 Row
- Pitch :
- 1.27 mm
- Product :
- Headers
- Series :
- FW-SM
- Stack Height :
- 2.16 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors
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Associated Product
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP
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