Product overview
- Part Number
- DF33-2S-3.3C
- Manufacturer
- Hirose Electric
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors SOC HSG 2POS 3.3MM
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Tin
- Current Rating :
- 5 A
- Housing Material :
- Polyamide (PA)
- Maximum Operating Temperature :
- + 85 C
- Minimum Operating Temperature :
- - 35 C
- Mounting Angle :
- Straight
- Number of Positions :
- 2 Position
- Number of Rows :
- 1 Row
- Packaging :
- Bulk
- Pitch :
- 3.3 mm
- Product :
- Receptacles
- Series :
- DF33C
- Termination Style :
- Crimp
- Voltage Rating :
- 500 V
Description
Board to Board & Mezzanine Connectors SOC HSG 2POS 3.3MM
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Associated Product
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP
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