Product overview
- Part Number
- SF500-313005
- Manufacturer
- CUI Devices
- Product Category
- Thermal Interface Products
- Description
- Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
Product Attributes
- Breakdown Voltage :
- 2.5 kVAC
- Color :
- Blue
- Length :
- 31.25 mm
- Material :
- Silicone Elastomer
- Maximum Operating Temperature :
- + 200 C
- Minimum Operating Temperature :
- - 58 C
- Product :
- Thermally Conductive Gap Pad
- Series :
- SF500
- Tensile Strength :
- 25 psi
- Thermal Conductivity :
- 3 W/m-K
- Thickness :
- 0.5 mm
- Width :
- 30 mm
Description
Thermal Interface Products Thermal Pad, Silicone Elastomer, 3.0 W/m*K Thermal Conductivity
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
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