Product overview
- Part Number
- 609-50ABS3
- Manufacturer
- Wakefield-Vette
- Product Category
- Heat Sinks
- Description
- Heat Sinks Pin Fin Heat Sink/Clip Assembly for 40/45mm BGA and PowerPC Packages, Aluminum, Black Anodized, 73.5x50.8x12.7mm, Bergquist Q-Pad 3, 0.14 C in2/w
Product Attributes
- Designed for :
- BGA, Super BGA, PBGA, FPBGA, PowerPC
- Fin Style :
- Extruded Axial Fin
- Heatsink Material :
- Aluminum
- Mounting Style :
- Screw
- Product :
- Heat Sinks
Description
Heat Sinks Pin Fin Heat Sink/Clip Assembly for 40/45mm BGA and PowerPC Packages, Aluminum, Black Anodized, 73.5x50.8x12.7mm, Bergquist Q-Pad 3, 0.14 C in2/w
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Associated Product
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP
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