Product overview
- Part Number
- HW-06-17-G-D-330-SM
- Manufacturer
- Samtec
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Product Attributes
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 12 Position
- Number of Rows :
- 2 Row
- Packaging :
- Tube
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- HW
- Stack Height :
- 8.38 mm
- Termination Style :
- Solder
Description
Board to Board & Mezzanine Connectors High Temperature Flexible Board Stacking Header, 0.100 Pitch
Wait 15 S
More stock is coming...
Associated Product
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP
You May Also Be Interested In
851-06RC16-8PX50
85106RC168PY50
EN2997SE01610F8
EN2997SE01610F6
EN2997SE01610F7
EN2997S02461M6
MS27467T25F46B
EN3646A02016BN
D38999/26FJ43SB
EN2997SEA1831MN
EN2997SEA1831M6
EN2997S62239AN
EN2997S62219A6
EN2997S62255AN
EN2997S62255A6
EN2997S62219AN
EN3646A61811MY
MS27468T23F21AB
851-01R14-19SW50
MS27468T17B35PD