Product overview
- Part Number
- 471-3025-600
- Manufacturer
- Amphenol TCS
- Product Category
- Board to Board & Mezzanine Connectors
- Description
- Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
Product Attributes
- Contact Material :
- Copper Alloy
- Contact Plating :
- Gold
- Current Rating :
- 1 A
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Data Rate :
- 12.5 Gb/s
- Maximum Operating Temperature :
- + 105 C
- Minimum Operating Temperature :
- - 40 C
- Mounting Angle :
- Vertical
- Number of Positions :
- 300 Position
- Packaging :
- Tray
- Pitch :
- 1.15 mm
- Product :
- Plugs
- Series :
- NeXLev
- Stack Height :
- 10 mm, 13 mm, 18 mm, 23 mm, 26 mm
- Termination Style :
- BGA
- Voltage Rating :
- 600 V
Description
Board to Board & Mezzanine Connectors 300P NeXLev Plug Solder Balls
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Associated Product
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP
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