Product overview
- Part Number
- 511-3U
- Manufacturer
- Wakefield-Vette
- Product Category
- Heat Sinks
- Description
- Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays
Product Attributes
- Designed for :
- Power Modules, IGBTs, Relays
- Fin Style :
- Rectangular, Fin
- Heatsink Material :
- Aluminum
- Height :
- 61.21 mm
- Length :
- 76.2 mm
- Mounting Style :
- Adhesive
- Product :
- Heat Sinks
- Thermal Resistance :
- 0.9 C/W
- Width :
- 132.33 mm
Description
Heat Sinks High Fin Density Heat Sinks for Power Modules, IGBTs & Relays
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Associated Product
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor 288-NFBGA -40 to 105
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Dig Signal Cntrlr
-
Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point DSPs TMS320 Platform
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Fixed-Point Digital Signal Processor
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Texas InstrumentsDigital Signal Processors & Controllers - DSP, DSC Video/Imaging Fixed-Point DSP
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