external assessment
 

Description: Appearance testing refers to confirmation of the number of chips received, inner packaging, humidity indication, desiccant requirements and appropriate outer packaging. Secondly, the appearance of a single chip is inspected, which mainly includes: chip typing, year, country of origin, whether it has been re-coated, the state of the pins, whether there are traces of re-polishing, unknown residues, and the location of the manufacturer's logo.

Scope of application: According to relevant testing standards, determine whether the chip is new or refurbished, whether the pins are tinned, oxidized, etc.

external assessment

Solderability test
 

Description: According to the test standard of solderability test, this test mainly detects whether the tinning ability of the chip pins meets the standard.

Solderability test

X-Ray
 

Description: X-ray testing is a real-time non-destructive analysis to check the hardware components inside the component. It mainly checks the chip’s lead frame, wafer size, gold wire bonding diagram, ESD damage and holes. X-ray can confirm that the chip is Whether the wire bonding and chip bonding are in good condition; the ROHS test is a comparative inspection of the environmental protection of the product pins through photovoltaic equipment and the lead content of the solder coating. Customers can provide good products for comparative inspection.

Scope of application: Detection of internal cracks and foreign objects in metal materials and parts, plastic materials and parts, electronic components, electronic assemblies, LED components, etc., analysis of internal displacements of BGA, circuit boards, etc.; identification of empty welding and empty welding Waiting for analysis of BGA welding defects, etc.

X-ray and ROHS testing

Open lid detection
 

Description: Uncovering (unsealing) mainly uses instruments to corrode the package on the surface of the chip, and check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, and the wafer code, which can determine the authenticity of the chip.

Application scope: verification of chip authenticity and failure analysis, etc.

Open lid detection

Electrical properties
 

According to the device pins and related instructions specified by the manufacturer in the specification, use a semiconductor tube characteristic grapher to check the chip through open circuit and short circuit tests.

Electrical performance test


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