Description: Appearance test means to confirm the number of chips received, inner packaging, humidity indicator, desiccant requirements and appropriate outer packaging. Secondly, the appearance of a single chip is inspected, including: the typing of the chip, the year, the country of origin, whether it is re-coated, the state of the pins, whether there are traces of re-grinding, unidentified residues, and the location of the manufacturer's logo.

Application scope:   Determine whether the chip is brand new, refurbished, whether the pins are tinned, oxidized, etc. according to relevant testing standards.

Description: According to the test standard of the solderability test, this test mainly detects whether the soldering ability of the chip pins meets the standard.

Description: X-ray test is a real-time non-destructive analysis to check the internal hardware components of the component. It mainly checks the lead frame of the chip, wafer size, gold wire bonding diagram, ESD damage and holes. Customers can provide good products for comparison. examine.

Application scope:   detection of internal cracks and foreign body defects in metal materials and parts, plastic materials and parts, electronic components, electronic components, LED components, etc., analysis of internal displacements such as BGA, circuit boards, etc.; distinguishing empty welding and virtual welding Wait for BGA welding defect analysis, etc.

Description: Opening (unsealing) is mainly to use instruments to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, and the wafer code to determine the authenticity of the chip.

Application scope: other chip authenticity verification and failure analysis.

According to the device pins and related instructions specified by the manufacturer in the specification, use a semiconductor tube characteristic grapher to check whether the chip is damaged through open circuit and short circuit tests.